Siemon to Showcase AI-Ready Connectivity Solutions at YOTTA 2025
The Siemon Company, a global market leader in the design and manufacture of high-performance connectivity solutions for data centers and smart buildings, is excited to announce its participation in YOTTA 2025, taking place September 8–10 at the MGM Grand in Las Vegas. Siemon will exhibit at Booth #604, where its team of AI and Data Center Infrastructure specialists will engage with attendees on the future of high-performance, scalable connectivity.
WATERTOWN, Conn., Aug. 29, 2025 /PRNewswire-PRWeb/ -- The Siemon Company, a global market leader in the design and manufacture of high-performance connectivity solutions for data centers and smart buildings, is excited to announce its participation in YOTTA 2025, taking place September 8–10 at the MGM Grand in Las Vegas. Siemon will exhibit at Booth #604, where its team of AI and Data Center Infrastructure specialists will engage with attendees on the future of high-performance, scalable connectivity.
Siemon's experts will be on-site to discuss the company's full portfolio of copper, fiber and high-speed connectivity solutions. These solutions meet all bandwidth, speed, latency, and density requirements, supporting architectures to 800 Gig and beyond, and up to 1.6T for hyperscale and AI cloud providers.
Live demos will highlight how Siemon's solutions deliver low-power, interoperable connectivity in high-density environments, while addressing key challenges such as supply chain agility, sustainability, and future readiness.
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