Sarcina Technology Joins Intel Foundry Services (IFS) Accelerator Design Services Alliance
Brings Application Specific Advanced Packaging Services to IFS customers
PALO ALTO, Calif., Jan. 25, 2024 /PRNewswire/ -- Sarcina Technology, the leading Application Specific Advanced Packaging service (ASAP), announced today that it has joined Intel Foundry Services (IFS) Accelerator Design Services Alliance.
Sarcina has built the ASAP category by providing dependable, creative, and assured advanced technology package design, test, assembly, and production management services. It provides semiconductor companies around the globe with package design, power/signal integrity simulation, wafer probing and final test hardware design, test program development, and production services. It brings to the table its extensive expertise in package design and simulations on various packages, including 2.5D advanced packaging technology for varied applications.
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